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Lenovo Dual Socket FCLGA3647 Intel C624 Chipset E-ATX Motherboard Supports 1st/2nd Gen Intel Xeon Scalable Processors 24x DDR4 DIMM Slots 02JG889

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Original price $117.99 - Original price $117.99
Original price
$117.99
$117.99 - $117.99
Current price $117.99
SKU 02JG889
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  • Specifications
  • Description
Manufacturer Part Number 02JG889
Manufacturer Lenovo
Condition Refurbished
Standard Warranty 90 Day Replacement Warranty
Item Category System Boards
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Lenovo 02JG889 ThinkSystem SR630 Motherboard Dual LGA3647 C624 E-ATX

Maximize your enterprise uptime and computational density with the Lenovo 02JG889 System Motherboard. Engineered for high-performance 1U data center deployments, this dual-socket E-ATX system board delivers structural stability, massive memory scalability, and uncompromised reliability. Whether you are replacing a mission-critical component or maintaining high-availability clusters, this genuine Lenovo system board provides the foundational powerhouse your data infrastructure demands.

Complete Technical Specifications

  • Part Number: 02JG889
  • Alternate Part Numbers (MPNs): 01GV276, 01PE248
  • Form Factor: Enhanced ATX (E-ATX)
  • Chassis Profile Compatibility: 1U Rackmount Server
  • Processor Sockets: 2x FCLGA3647 (Dual Socket Architecture)
  • Processor Support: 1st and 2nd Generation Intel Xeon Scalable Processors (Platinum, Gold, Silver, Bronze tiers)
  • Core Logic Chipset: Intel C624 Server Chipset
  • Total Memory Slots: 24x DIMM Slots (12x DIMMs per CPU)
  • Memory Type Support: TruDDR4 SDRAM
  • I/O and Connectivity Interfaces: 2x USB 3.0 Ports, 1x Internal USB 2.0 Port, 1x VGA Video Output, 1x Dedicated Management Port
  • Networking Expandability: Integrated LOM / OCP Modular Slot for flexible NIC scaling

Universal Hardware Cross-Compatibility

Avoid the frustration of vendor lock-in. This motherboard features high flexibility across Lenovo's 1U server platforms. It is a direct drop-in replacement part for the following enterprise hardware systems:

  • Standard Enterprise Rack Platforms: Lenovo ThinkSystem SR630 (Gen 1 / Gen 2)
  • Hyperconverged Infrastructure (HCI): Lenovo ThinkAgile HX3321 & ThinkAgile HX3320 (Nutanix Web-Scale Software Optimized)
  • Software-Defined Storage Frameworks: Lenovo ThinkAgile VX3320 (VMware vSAN Validated Node)

Thermal and Infrastructure Matching

  • Heatsink Matching: Validated for the Lenovo 01KP651 1U 3-Heatpipe Performance Heatsink.
  • Thermal Design Power (TDP): Safely supports processors rated up to a 165W thermal threshold under maximum workloads.
  • Firmware Lifecycle Management: Integrated Lenovo XClarity Controller (XCC / IMM) allows for seamless remote firmware deployment, automated hardware health telemetry, and standard environment restoration.