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HPE ProLiant DL380 Gen10 Server High Performance CPU Heatsink. P/N: 875071-001.

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Original price $48.74
Original price $48.74 - Original price $48.74
Original price $48.74
Current price $41.99
$41.99 - $41.99
Current price $41.99
SKU 875071-001
Availability:
Out of stock

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  • Specifications
  • Description
Manufacturer Part Number 875071-001, 873595-001, 839275-001
Manufacturer HPE
Condition Refurbished
Standard Warranty 90 Day Replacement Warranty
Item Category Server Heatsink
Model High Performance CPU Heatsink
Form Factor 2U
Interface
External Interfaces
Storage Capacity
Transfer Rate
Network Management Type
Processor Type
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Cache
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TDP
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CPU Type
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HDD Interface
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HDD Storage Capacity
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Memory Capacity Per Module
Memory Features
Memory Form Factor
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Memory Kit Technology
Memory Kit Total Capacity
Memory Kit Voltage
Memory Number of Modules
Memory Number of Pins
Memory Total Capacity
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This is a genuine HPE ProLiant DL380 Gen10 High Performance CPU Heatsink (P/N: 875071-001). This is the upgraded, factory-original heatsink required to properly cool high-TDP (Thermal Design Power) processors in the HPE ProLiant DL380 Gen10 server. It is engineered with a larger surface area and a more advanced fin design than the standard heatsink, ensuring maximum heat dissipation for the most powerful CPUs and preventing thermal throttling under heavy computational loads.


 

Key Features 

 

  • Genuine HPE Part: Ensures a perfect fit and optimal thermal contact and performance as tested and certified by HPE for the DL380 Gen10 chassis.

  • Required for High-TDP CPUs: This specific heatsink is mandatory for server configurations using high-wattage processors (typically 125W TDP and above). The standard heatsink is not sufficient for these top-tier CPUs.

  • Superior Cooling Performance: Its design is optimized to provide maximum cooling efficiency within the airflow constraints of a 2U server chassis, making it ideal for High-Performance Computing (HPC), AI, or dense virtualization workloads.

  • Durable Construction: Made from high-quality copper and aluminum to ensure excellent and reliable heat transfer away from the processor.