HP Apollo 4200 Gen10 (G10) High Performance CPU Heatsink. P/N: P08343-001.
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- Specifications
- Description
| Manufacturer Part Number | P08343-001, P09884-001, P09711-001 |
| Manufacturer | HPE |
| Condition | Refurbished |
| Standard Warranty | 90 Day Replacement Warranty |
| Item Category | CPU Heatsink / Server Cooling |
| Model | |
| Form Factor | Proprietary Server Heatsink |
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| Socket Type | FCLGA3647 (for Intel Xeon Scalable) |
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This is an HP Apollo 4200 Gen10 (G10) High Performance CPU Heatsink (P/N: P08343-001, P09884-001, P09711-001). Specifically designed for the HP Apollo 4200 Gen10 server series, this heatsink is an essential component for managing the thermal output of high-performance processors in this unique high-density storage server. It ensures optimal operating temperatures, which is critical for processor stability, extending CPU lifespan, and achieving maximum compute performance, especially under demanding, data-intensive workloads.
The "High Performance" designation indicates that this heatsink is optimized for CPUs with higher Thermal Design Power (TDP) or for server configurations where superior cooling is required to prevent thermal throttling. The HP Apollo 4200 Gen10 is known for its incredible storage density and compute capabilities, and this heatsink is engineered to handle the thermal challenges associated with such powerful configurations. It provides efficient heat dissipation, maintaining consistent CPU performance for applications like big data analytics, object storage, and content delivery networks.
Key Features
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Genuine HP Part: Ensures perfect compatibility and optimal thermal performance within HP Apollo 4200 Gen10 servers.
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High Performance Cooling: Engineered to efficiently dissipate heat from high-TDP CPUs.
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Designed for Apollo 4200 G10: Specifically compatible with the HP Apollo 4200 Gen10 server platform.
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Optimizes CPU Performance: Maintains stable operating temperatures to prevent thermal throttling and maximize processor output.
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Extends CPU Lifespan: Proper cooling reduces stress on the processor, contributing to longer component longevity.
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Robust Construction: Built with durable materials for reliable, long-term operation in demanding data center environments.
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Essential for Compute Stability: Crucial for managing the thermal requirements of powerful processors in high-density storage servers.